Consortium:
New millimetre-wave techniques for the experimental characterisation and computational modelling of metallic materials and applications in advanced manufacturing of circuit foils in Europe
Call: Eurostars 3 - Call 4
Eurostars is part of the European Partnership on Innovative SMEs. The partnership is co-funded by the European Union through Horizon Europe. The work in 5G_Foil project is co-funded by the Polish National Centre for Research and Development under contracts InnovativeSMEs/4/100/5G_Foil/2023 and InnovativeSMEs/4/90/5G_Foil/2023, and by the Luxembourg Ministry of Economy under contract 2023-A127-X187.
International Consortium:
Consortium Leader: QWED Sp. z o.o.
Partners:
Poland: EM Invent Sp. z o.o.
Luxembourg: Circuit Foil Luxembourg sŕrl
Duration: 01.11.2023 - 31.10.2026
5G Foils Events:
June 15-20, 2025, San Francisco, CA, US
IEEE MTT-S International Microwave Symposium (IMS)

April 8-10, 2025, Vienna, Austria
5th EMMC International Workshop (EMMC 2025 - Accelerated Innovation and Sustainability by a Materials Modelling and Data Ecosystem)

March 17-19, 2025, Dresden, German
The 16th German Microwave Conference GeMiC

January 29-30, 2025, Vienna, Austria
1st Pan-European Electronics Design Conference (PEDC)

January 22-24, 2025, San Juan, Puerto Rico
5th MTT-S Latin America Microwave Conference (LAMC 2025)

January 19-22, 2025, San Juan, Puerto Rico
2025 IEEE Radio & Wireless Week (RWW2025)

December 9-10, 2024, Belgrade, Serbia
OneHealth: Stakeholder Meeting to Boost Excellence in Research and Innovation Ecosystems for Equity in Health Stakeholder visit to VINCA Institute of Nuclear Sciences

November 19, 2024, Warsaw, Poland
1st Annual Meeting

August 11-14, 2024, Montreal, Canada
IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization

July 1-4, 2024, Wroclaw, Poland
The 11th Microwave & Radar Week MIKON

June 16-21, 2024, Washington, USA
IEEE International Microwave Symposium

June 3-5, 2024, Namur, Belgium
INDTech Conference on Industrial Technologies

June 4, 2024, Warsaw, Poland
Space Sector Forum

April 9-11, 2024, Anaheim, USA
IPC APEX EXPO 2024

October 25-27, 2023, Taipei, Taiwan
18th International Microsystems, Packaging, Assembly and Circuits Technology Conference
5G Foils Articles, Presentations, Posters & Outreach:
1.
M.Celuch, "Modelling-based characterisation of copper foils for mmWave applications", IMPACT 2023: Intl. Microsystems, Packaging, Assembly and Circuits Technology Conf., Taipei, Taiwan, 25-27 Oct. 2023.
2.
Malgorzata Celuch, Marzena Olszewska-Placha, Lukasz Nowicki, Pawel Kopyt, Jerzy Cuper, "Evaluation of Surface Roughness of Copper Foils for 5G Applications Using Novel mmWave Resonators", Apex Expo IPC, Anaheim, USA,  April 9, 2024. (paper under IPC Copyright, provided here with kind permission from the IPC).
3.
T. Nalecz, L. Nowicki, M. Celuch, M. Baranowski, A. Lamecki, M. Mrozowski, "An Open Platform Tool for 2D Multipactor Simulations in Metallic Microwave Components", 25th International Microwave and Radar Conference MIKON, 1-3 July 2024, Wroclaw, Poland - poster.
4.
M. Celuch, T. Devahif, T. Nalecz, J. Rudnicki, "A Systematic Study of Correlation between Surface Roughness and Microwave Effective Conductivity of Copper Foils for Ultra-Low-Loss Applications", 25th International Microwave and Radar Conference MIKON, 1-3 July 2024, Wroclaw, Poland - presentation.
5.
M. Olszewska-Placha, "2D Scanner for Surface-Wise Measurements of Complex Permittivity of Emerging LTCC and ULTCC Materials", Microwave Application Seminars MicroApps TUMA2, 18 June 2024
6.
M. Celuch, "Screening of the mmWave Signal Loss Properties of Copper Foils without the Need for Test Circuit Manufacturing", Microwave Application Seminars MicroApps TUMA11, 18 June 2024.
7.
M. Celuch, "Accurate Materials Testing as an Enabler for Microwave and Millimeter-Wave Industries", Industry Keynote, IEEE IMS2024, Washington DC, 20 June 2024. Th1E-1.
8.
M. Celuch, M. Olszewska-Placha, L. Nowicki and W. Gwarek, "A Novel Q-Choked Resonator for Microwave Material Measurements Alleviating Sample Thickness Limitations of Existing Techniques", in IEEE Microwave and Wireless Technology Letters, vol. 34, no. 6, pp. 845-848, June 2024 - presentation.
9.
M. Celuch, T. Devahif, T. Nalecz, J. Rudnicki, "Modeling-Based Methodology for Electromagnetic Screening of Copper Foils for High-Frequency Applications", IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO'2024), 12-14 August 2024, Montreal, Canada - presentation.
10.
T. Nalecz, M. Baranowski, M. Celuch, A. Lamecki, L. Nowicki, M. Mrozowski, "Multipactor Modeling in 2D for Open Insight into the EM Behavior of Metalic Microwave Components", IEEE MTT-S International Conference on Numerical Electromagnetic and Multiphysics Modeling and Optimization (NEMO'2024), 12-14 August 2024, Montreal, Canada - presentation.
11.
L. Nowicki, A. Romanowska, M. Celuch,A. Chlanda, "2D Imaging of Graphene Oxide Electric Parameters with a 10 GHz Inverted Single-Post Dielectric Resonator", W: 2025 IEEE MTT-S Latin America Microwave Conference (LAMC). 2025. s. 62–65. doi:10.1109/LAMC63321.2025.10880544
12.
L. Nowicki, T. Nalecz, M. Celuch, T. Devahif, J. Rudnicki, „Application of Dual-Mode Ruby Dielectric Resonator for Characterization of Copper Foils in High-Frequency Circuits”, 104th ARFTG 19-22 January, 2025, San Juan, USA – Poster.
13.
L. Nowicki, M. Celuch, M. Olszewska-Placha, J. Rudnicki, „Enhanced Modeling and Characterization of Copper Foils for PCB Design”, 1st Pan-European Electronic Design Conference PEDC, 29-31 January 2025, Vienna, Austria: Presentation.
14.
L. Nowicki, M. Celuch, J.Rudnicki, “A Specialized Overlay for Advanced Full-Wave Electromagnetic Simulations within 3D CAD Environment”, IPC Apex 2025, 19 March 2025, Anaheim, CA, USA: Presentation.
15.
W. Gwarek, M. Celuch and L. Nowicki, "A Novel Q-Choked Sapphire Sandwiched Resonator for Wideband Measurements of Flat Dielectric Samples,"https://ieeexplore.ieee.org/document/11006028 in IEEE Microwave and Wireless Technology Letters, doi: 10.1109/LMWT.2025.3568534.